Home → Magazine Archive → November 2013 (Vol. 56, No. 11)

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Centip3De: A Many-Core Prototype Exploring 3D Integration and Near-Threshold Computing

This paper evaluates the use of three-dimensional integration to reduce global interconnect by adding multiple layers of silicon with vertical connections between them using through-silicon vias.

Ronald G. Dreslinski, David Fick, Bharan Giridhar, Gyouho Kim, Sangwon Seo, Matthew Fojtik, Sudhir Satpathy, Yoonmyung Lee, Daeyeon Kim, Nurrachman Liu, Michael Wieckowski, Gregory Chen, Dennis Sylvester, David Blaauw, Trevor Mudge

Pages 97-104