The U.S. National Science Foundation (NSF) and the Semiconductor Research Corp. (SRC) recently announced Failure-Resistant Systems, a joint initiative that seeks proposals for new techniques that would ensure the reliability of systems.
The proposals should focus on a system-level cross-layer approach to reliability, and encompass the failure mechanisms of both digital and analog components. Such a technique would potentially offer high reliability and lower power and performance overheads.
"By distributing reliability across the system design stack, cross-layer approaches can take advantage of the information available at each level, including even application-level knowledge, to efficiently tolerate errors, aging, and variation," the initiative's solicitation says. "This will allow handling of different physical effects at the most efficient stack layer, and can be adapted to varying application needs, operating environments, and changing hardware state."
NSF and SRC plan to fund 15 to 20 awards, each ranging from $300,000 to $400,000, over three years. The deadline for proposals is June 26, 2012.
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